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FT221XQ-T

FTDI FT221XQ-T

USB, SPI, Sync Parallel3,3 В ~ 5 ВПоверхностный монтаж

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FT221XQ-T
IC INTERFACE SPECIALIZED 20QFN
FT221XQ-T Техническое описание(pdf)
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Цена договорная

Обновление цены:несколько месяцев назад

Гарантия качества Bostock

912ob9001 201514001 201545001 201813485 2016esdduns
Детали продукта

Overview

The FT220XS-R is IC USB 4 BIT SPI/FT1248 16SSOP, that includes USBmadeEZ-FIFO, FT-X, X-Chip Series, they are designed to operate with a USB Bridge Controllers Product, Type is shown on datasheet note for use in a Bridge USB to SPI/FT1248, that offers Packaging features such as Digi-ReelR Alternate Packaging, Unit Weight is designed to work in 0.004586 oz, as well as the SMD/SMT Mounting Style, the device can also be used as X-Chip Tradename. In addition, the Package Case is 16-SSOP (0.154", 3.90mm Width), it has an Operating Temperature range of -40°C ~ 85°C, the device has a Bridge, USB to FT1248 of Function, and Interface is FT1248, and the Voltage Supply is 3.3 V ~ 5 V, and Supplier Device Package is 16-SSOP, and the Speed is High-Speed, and Current Supply is 10.5mA, and the Protocol is USB, and Standards is USB 2.0, and the Data Rate is 480 Mb/s 12 Mb/s, it has an Maximum Operating Temperature range of + 85 C, and the Operating Supply Voltage is 2.97 V to 5.5 V, and Standard is USB 2.0, and the Operating Supply Current is 9.7 mA to 12.3 mA, and Interface Type is USB.

The FT220XQ-T is IC USB 4 BIT SPI/FT1248 16QFN, that includes 10.5mA Current Supply, they are designed to operate with a 480 Mb/s Data Rate, Function is shown on datasheet note for use in a Bridge, USB to FT1248, that offers Interface features such as FT1248, Mounting Style is designed to work in SMD/SMT, it has an Operating Temperature range of -40°C ~ 85°C, the device can also be used as 16-WQFN Exposed Pad Package Case. In addition, the Packaging is Tray Alternate Packaging, the device is offered in USB Bridge Controllers Product, the device has a USB of Protocol, and Series is USBmadeEZ-FIFO, FT-X, X-Chip, and the Speed is High-Speed, and Standard is USB 2.0, and the Standards is USB 2.0, and Supplier Device Package is 16-QFN (4x4), and the Tradename is X-Chip, and Type is Bridge USB to SPI/FT1248, and the Unit Weight is 0.002014 oz, and Voltage Supply is 3.3 V ~ 5 V.

Features

Tray Package
Set the part at 5V volts
MICROPROCESSOR CIRCUIT of uPs/uCs/Peripheral ICs Type

Surface Mount Mounting Type

Applications


There are a lot of FTDI, Future Technology Devices International Ltd
FT221XQ-T Specialized Interface ICs applications.

  • Medical/Industrial
  • Imaging
  • Ultrasound
  • Audio and video switching
  • Automatic test equipment
  • Precision data acquisition
  • Battery-powered systems
  • Sample-and-hold systems
  • Communication systems
  • Data Acquisition Systems
Характеристики продукта
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Модельный ряд: USBmadeEZ-FIFO, FT-X, X-Chip
Пакет: Лоток
Статус части: Активный
Интерфейс: USB, SPI, Sync Parallel
Напряжение питания: 3,3 В ~ 5 В
Упаковка / Кейс: 20-WFQFN Открытая панель
Поставщик Упаковка устройства: 20-QFN (4x4)
Тип крепления: Поверхностный монтаж
FTDI, Future Technology Devices International Ltd

FTDI, Future Technology Devices International Ltd

Future Technology Devices International Ltd (FTDI) - полупроводниковая компания без фабрики, специализирующаяся на USB-технологиях, основанная в 1992 году со штаб-квартирой в Глазго, Великобритания. Компания разрабатывает и производит интегральные схемы, модули и кабели, поддерживающие USB-соединение, обеспечивая высокопроизводительные, маломощные и простые в использовании решения для широкого спектра электронных конструкций.

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Bostock по цифрам

Доход: 85M

$85 миллионов в доходах в 2022 году, увеличение на 63% по сравнению с 2021 годом.

Страны: 105

Bostock обслуживает клиентов в 105 странах мира.

Отгруженные части: 25M+

Мы отгрузили более 25 миллионов частей за последние пять лет, что составляет увеличение на 148% по сравнению с предыдущими пятью годами.

Производители: 950

В 2022 году Bostock продал части от более чем 950 производителей.

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