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DK-SI-AGI027FA

Intel DK-SI-AGI027FA

FPGA + MCU/MPU SoCAGIB027Приемопередатчик Agilex I-Series SoC FPGA - SoCСовет(ы)

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Intel
DK-SI-AGI027FA
I-SERIES TRANSCEIVER-SOC DEVELOP
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₽1070712.74

Обновление цены:несколько месяцев назад

Гарантия качества Bostock

912ob9001 201514001 201545001 201813485 2016esdduns
Детали продукта

Overview

The 027301.5H is FUSE BOARD MOUNT 1.5A 125VAC/VDC, that includes MICRO? 273 Series, they are designed to operate with a PCB Mount Fuse Product, Type is shown on datasheet note for use in a Specialty Fuses, that offers Packaging features such as Bulk Alternate Packaging, Current Rating is designed to work in 1.5A, as well as the Radial Termination Style, the device can also be used as MICRO TR3 Tradename, it has an Operating Temperature Range range of - 55 C to + 85 C, the device is offered in 8.89 mm Length, the device has a Radial, Can, Vertical of Package Case, it has an Operating Temperature range of -55°C ~ 85°C, and the Mounting Type is Through Hole, and Size Dimension is 0.250" Dia x 0.350" H (6.35mm x 8.89mm), and the Voltage Rating AC is 125V, and Voltage Rating DC is 125V, and the Fuse Type is Board Mount (Cartridge Style Excluded), and Response Time is Fast, and the Approvals is CSA, QPL, UL, and Breaking Capacity Rated Voltage is 10kA, and the MeltingI2t is 0.16, and Diameter is 6.35 mm, and the Product Type is PCB Mount Fuse, and Resistance is 0.0578 Ohms, and the Fuse Size Group is MICRO, and Indicator Style is Without Indicator, and the Interrupt Rating is 10 kA at 125 VAC/DC, and Body Style is Leaded Fuses.

The 0273-0-15-01-16-01-10-0 is CONN RECEPTACLE PIN .078", that includes 0.022" ~ 0.034" (0.56mm ~ 0.86mm) Accepts Pin Diameter, they are designed to operate with a Tin-Lead Contact Finish, Contact Finish Thickness is shown on datasheet note for use in a 200μin (5.08μm), that offers Contact Material features such as Beryllium Copper, Flange Diameter is designed to work in 0.098" (2.49mm), as well as the 0.210" (5.33mm) Length Overall, the device can also be used as 0.078" (1.98mm) Mounting Hole Diameter. In addition, the Packaging is Bulk, the device is offered in 0.051" (1.30mm) Pin Hole Diameter, the device has a 273 of Series, and Socket Depth is 0.210" (5.33mm), and the Tail Type is No Tail, and Termination is Press-Fit.

Features

Bulk Package
FPGA + MCU/MPU SoC Type
AGIB027 For Use With/Related Products
Board(s) Contents
Характеристики продукта
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Модельный ряд: Agilex™ I-Series
Пакет: Насыпной
Статус части: Активный
Тип: FPGA + MCU/MPU SoC
Для использования с/сопутствующими продуктами: AGIB027
Платформа: Приемопередатчик Agilex I-Series SoC FPGA - SoC
Содержание: Совет(ы)
Intel

Intel

Корпорация Intel - ведущая мировая полупроводниковая компания, основанная в 1968 году со штаб-квартирой в Санта-Кларе, штат Калифорния, США. Intel известна своими инновационными процессорными технологиями и полупроводниковыми решениями для широкого спектра приложений в компьютерах, центрах обработки данных, Интернете вещей и коммуникационном оборудовании.

Новosti в реальном времени

Bostock по цифрам

Доход: 85M

$85 миллионов в доходах в 2022 году, увеличение на 63% по сравнению с 2021 годом.

Страны: 105

Bostock обслуживает клиентов в 105 странах мира.

Отгруженные части: 25M+

Мы отгрузили более 25 миллионов частей за последние пять лет, что составляет увеличение на 148% по сравнению с предыдущими пятью годами.

Производители: 950

В 2022 году Bostock продал части от более чем 950 производителей.

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