MACOM MADP-000402-12530P

PIN - одиночный100V250 мА0,06пФ при 40 В, 1 МГц1 W175°C (TJ)

Overview

This device is a Silicon-Glass PIN diode chipfabricated with MACOM's patentedHMICTM process. This device features twosilicon pedestals embedded in a low loss, low dispersionglass. The diode is formed on the top of onepedestal and connections to the backside of the deviceare facilitated by making the pedestal sidewallselectrically conductive. Selective backsidemetallization is applied producing a surface mountdevice. This vertical conic topology provides forexceptional heat transfer from the active area. Thetopside is fully encapsulated with silicon nitride andhas an additional polymer layer for scratch andimpact protection. These protective coatings preventdamage to the junction and the anode air-bridgeduring handling and assembly.These surmount devices are suitable for usage inmoderate incident power (5W C.W.) or higherincident peak power (50W) series, shunt, orseries-shunt switches. Lower parasitic inductance,0.45nH, and excellent RC constant (0.23pS), makethe devices ideal for higher frequency switchelements compared to their plastic devicecounterparts.

Features