Microchip AY-5-1016

Overview

The 06-1508-20 is CONN IC DIP SOCKET 6POS GOLD, that includes 508 Series, they are designed to operate with a DIP, 0.2" (5.08mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Wire Wrap, it has an Operating Temperature range of -55°C ~ 105°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, the device is offered in 6 (2 x 3) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass.

The 06-1508-31 is CONN IC DIP SOCKET 6POS GOLD, that includes Wire Wrap Termination, they are designed to operate with a Through Hole Mounting Type, Housing Material is shown on datasheet note for use in a Polyamide (PA46), Nylon 4/6, that offers Contact Finish Mating features such as Gold, Contact Finish Post is designed to work in Gold, as well as the DIP, 0.2" (5.08mm) Row Spacing Type, the device can also be used as Closed Frame Features. In addition, the Packaging is Bulk, the device is offered in Brass Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, and Number of Positions or Pins Grid is 6 (2 x 3), it has an Operating Temperature range of -55°C ~ 125°C, and Series is 508, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Finish Thickness Post is 10μin (0.25μm), and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).

Features