Microchip EV50P30A

ИнтерфейсEthernetСовет(ы)

Overview

The 08-3518-10M is CONN IC DIP SOCKET 8POS GOLD, that includes 518 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Open Frame Features, the device can also be used as Polyamide (PA46), Nylon 4/6, Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 8 (2 x 4), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Brass.

The 08-3518-11H is CONN IC DIP SOCKET 8POS GOLD, that includes Through Hole Mounting Type, they are designed to operate with a Solder Termination, Housing Material is shown on datasheet note for use in a Polyamide (PA46), Nylon 4/6, Glass Filled, that offers Features features such as Open Frame, Contact Finish Mating is designed to work in Gold, as well as the Gold Contact Finish Post, the device can also be used as DIP, 0.3" (7.62mm) Row Spacing Type. In addition, the Packaging is Bulk, the device is offered in Brass Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, and Number of Positions or Pins Grid is 8 (2 x 4), and the Series is 518, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Thickness Post is 10μin (0.25μm), and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm).

Features