Microchip HYC2489S-R

НасыпнойУстаревший

Overview

HYC18DRMI with pin details, that includes Series, they are designed to operate with a Tray Packaging, Termination is shown on datasheet note for use in a Wire Wrap, it has an Operating Temperature range of -65°C ~ 125°C, Mounting Type is designed to work in Through Hole, as well as the Beryllium Copper Contact Material, the device can also be used as Gold Contact Finish. In addition, the Contact Finish Thickness is 30μin (0.76μm), the device is offered in 36 Number of Positions, the device has a 0.100" (2.54mm) of Pitch, and Number of Rows is 2, and the Gender is Female, and Contact Type is Loop Bellows, and the Card Thickness is 0.062" (1.57mm), and Flange Feature is Top Mount Opening, Threaded Insert, 4-40, and the Card Type is Non Specified - Dual Edge, and Number of Positions Bay Row is 18.

HYC0UGG0MF2P-5S60E-C with EDA / CAD Models manufactured by HYNIX. The HYC0UGG0MF2P-5S60E-C is available in BGA Package, is part of the IC Chips.

Features