Microsemi 090-44310-11

КристаллАтомный10 МГцCMOS5V1ppb

Overview

The 110-43-308-10-001000 is CONN IC DIP SOCKET 8POS GOLD, that includes 110 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Open Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in 8 (2 x 4), 4 Loaded Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 30μin (0.76μm), and Contact Material Post is Brass Alloy.

The 110-43-308-41-001000 is CONN IC DIP SOCKET 8POS GOLD, that includes Tube Packaging, they are designed to operate with a Tin Contact Finish Post, Mounting Type is shown on datasheet note for use in a Through Hole, that offers Termination features such as Solder, Housing Material is designed to work in Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, as well as the Open Frame Features, the device can also be used as Gold Contact Finish Mating. In addition, the Type is DIP, 0.3" (7.62mm) Row Spacing, the device is offered in Brass Alloy Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, and Number of Positions or Pins Grid is 8 (2 x 4), it has an Operating Temperature range of -55°C ~ 125°C, and Contact Finish Thickness Mating is 30μin (0.76μm), and the Contact Finish Thickness Post is 200μin (5.08μm), and Series is 110, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).

Features