Microsemi LX4510SFQ

НасыпнойАктивный

Overview

The 10076529-35105EHLF is CONN FFC BOTTOM 35POS 0.5MM R/A, that includes VLK Series, they are designed to operate with a Tape & Reel (TR) Packaging, Voltage Rating is shown on datasheet note for use in a 50V, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 85°C, as well as the Surface Mount, Right Angle Mounting Type, the device can also be used as Solder Retention, Zero Insertion Force (ZIF) Features. In addition, the Height Above Board is 0.051" (1.30mm), the device is offered in Copper Alloy Contact Material, the device has a Gold of Contact Finish, and Number of Positions is 35, and the Pitch is 0.020" (0.50mm), and Housing Material is Thermoplastic, and the Flat Flex Type is FFC, FPC, and FFC FCB Thickness is 0.30mm, and the Locking Feature is Flip Lock, and Material Flammability Rating is UL94 V-0, and the Connector Contact Type is Contacts, Bottom, and Cable End Type is Straight, Tapered, and the Actuator Material is Thermoplastic.

100-7651-01 with circuit diagram manufactured by SUN. The 100-7651-01 is available in BGA Package, is part of the IC Chips.

Features