NS 4035BDC

4Параллельно - параллельно

Overview

The 40-3575-10 is CONN IC DIP SOCKET ZIF 40POS GLD, that includes 57 Series, they are designed to operate with a DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Closed Frame Features, the device can also be used as Polyphenylene Sulfide (PPS), Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 40 (2 x 20), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Gold, and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 10μin (0.25μm), and the Contact Material Post is Beryllium Copper.

The 40-3575-18 is CONN IC DIP SOCKET ZIF 40POS GLD, that includes Through Hole Mounting Type, they are designed to operate with a Solder Termination, Housing Material is shown on datasheet note for use in a Polyphenylene Sulfide (PPS), Glass Filled, that offers Contact Finish Mating features such as Gold, Contact Finish Post is designed to work in Gold, as well as the DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing Type, the device can also be used as Closed Frame Features. In addition, the Packaging is Bulk, the device is offered in Beryllium Copper Contact Material Mating, the device has a Beryllium Copper of Contact Material Post, and Series is 57, and the Number of Positions or Pins Grid is 40 (2 x 20), and Contact Finish Thickness Mating is 10μin (0.25μm), and the Contact Finish Thickness Post is 10μin (0.25μm), and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm).

Features