ON MC100LVEP14DTG

Fanout Buffer (распределение), мультиплексор12:5

Overview

The MC100LVEP11MNR4G is IC CLK BUFFER 1:2 3GHZ 8DFN, that includes 100LVEP Series, they are designed to operate with a Fanout Buffer (Distribution) Type, Packaging is shown on datasheet note for use in a Cut Tape (CT) Alternate Packaging, that offers Unit Weight features such as 0.001344 oz, Mounting Style is designed to work in SMD/SMT, as well as the 8-VFDFN Exposed Pad Package Case, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Mounting Type is Surface Mount, the device is offered in 2.375 V ~ 3.8 V Voltage Supply, the device has a 8-DFN (2x2) of Supplier Device Package, and Input is CML, LVDS, PECL, and the Output is ECL, PECL, and Number of Circuits is 1, and the Ratio Input:Output is 1899/12/30 1:02:00, and Differential Input:Output is Yes/Yes, and the Frequency Max is 3GHz, and Number of Outputs is 4 Output, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Part # Aliases is MC100LVEP11DTG, and Supply Voltage Max is +/- 3.8 V, and the Supply Voltage Min is +/- 2.375 V, and Maximum Input Frequency is 3000 MHz, and the Propagation Delay Max is 0.31 ns.

The MC100LVEP11MNR4 is IC CLK BUFFER 1:2 3GHZ 8DFN, that includes Yes/Yes Differential Input:Output, they are designed to operate with a 3GHz Frequency Max, Input is shown on datasheet note for use in a CML, LVDS, PECL, that offers Mounting Type features such as Surface Mount, Number of Circuits is designed to work in 1, it has an Operating Temperature range of -40°C ~ 85°C, the device can also be used as ECL, PECL Output. In addition, the Package Case is 8-VFDFN Exposed Pad, the device is offered in Tape & Reel (TR) Packaging, the device has a 1899/12/30 1:02:00 of Ratio Input:Output, and Series is 100LVEP, and the Supplier Device Package is 8-DFN (2x2), and Type is Fanout Buffer (Distribution), and the Voltage Supply is 2.375 V ~ 3.8 V.

Features

Applications

• High performance communication system
• Data center
• Cloud computing
• Network
• High speed industry
• High-end consumer electronics
• Data communication
• Telecommunications
• Computing
• Medical imaging