ON NB6L611MNG

Fanout Buffer (распределение)11:2

Overview

The NB6L56MNTXG is IC CLK BUFFER 2:1 2.5GHZ 32QFN, that includes ECLinPS MAX? Series, they are designed to operate with a Fanout Buffer (Distribution), Multiplexer, Data Type, Packaging is shown on datasheet note for use in a Tape & Reel (TR) Alternate Packaging, that offers Unit Weight features such as 0.006653 oz, Mounting Style is designed to work in SMD/SMT, as well as the 32-VFQFN Exposed Pad Package Case, it has an Operating Temperature range of -40°C ~ 85°C. In addition, the Mounting Type is Surface Mount, the device is offered in 2.375 V ~ 3.6 V Voltage Supply, the device has a 32-QFN (5x5) of Supplier Device Package, and Input is CML, LVDS, LVPECL, and the Output is LVPECL, and Number of Circuits is 2, and the Ratio Input:Output is 1899/12/30 2:01:00, and Differential Input:Output is Yes/Yes, and the Frequency Max is 2.5GHz, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Current is 85 mA, and the Maximum Input Frequency is 2.5 GHz, and Propagation Delay Max is 360 ps.

NB6L572MMNR4G with circuit diagram, that includes Yes/Yes Differential Input:Output, they are designed to operate with a 6GHz Frequency Max, Input is shown on datasheet note for use in a CML, LVDS, LVPECL, that offers Mounting Type features such as Surface Mount, Number of Circuits is designed to work in 1, it has an Operating Temperature range of -40°C ~ 85°C, the device can also be used as CML Output. In addition, the Package Case is 32-VFQFN Exposed Pad, the device is offered in Tape & Reel (TR) Packaging, the device has a 1899/12/30 4:02:00 of Ratio Input:Output, and Series is NB6L572M, and the Supplier Device Package is 32-QFN (5x5), and Type is Fanout Buffer (Distribution), Multiplexer, Translator, and the Voltage Supply is 2.375 V ~ 3.6 V.

Features

Applications

• Clock signal duplication
• Clock signal format conversion
• Clock signal level shifting
• High performance communication system
• Data center
• Cloud computing
• Network
• High speed industry
• High-end consumer electronics
• Data communication