Qualcomm DB-QCC5141-WLCSP94-A-0

Трансивер; Bluetooth® 5.x2,4 ГГцQCC5141

Overview

The 224-1286-00-0602J is CONN IC DIP SOCKET ZIF 24POS GLD, that includes Textool? Series, they are designed to operate with a DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Press-Fit, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Connector Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polysulfone (PSU), Glass Filled, the device is offered in 24 (2 x 12) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 30μin (0.76μm), and Contact Material Post is Beryllium Copper.

224150 with EDA / CAD Models manufactured by ERNI. is part of the Circular Connectors, , and with support for Circular Metric Connectors 3P 9/13MM STRGHT FML CODE A M8 STAMP CONT, Conn M8 Circular F 3 POS Solder ST SMD 3 Terminal 1 Port T/R.

Features