Qualcomm DL-BDEV-10002-1A

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Overview

1000240001 with pin details, that includes Black Color, they are designed to operate with a Omnimate BL Series, Type is shown on datasheet note for use in a Plug, Female Sockets, that offers Packaging features such as Bulk, Termination Style is designed to work in Screwless - Leg Spring, Push-In Spring, it has an Operating Temperature range of -50°C ~ 100°C, the device can also be used as Free Hanging (In-Line) Mounting Type. In addition, the Features is Mating Flange, Retention Latches (Wire Side), the device is offered in 4 Number of Positions, the device has a 0.200" (5.08mm) of Pitch, and Wire Gauge or Range AWG is 12-26 AWG, and the Wire Gauge or Range mm2 is 0.2-2.5mm2, and Current IEC is 24A, and the Voltage IEC is 400V, and Current UL is 18.5A, and the Voltage UL is 300V, and Number of Levels is 1, and the Positions Per Level is 4, and Plug Wire Entry is 90°, and the Contact Mating Finish is Tin.

100-024-000 with circuit diagram, that includes Gold Contact Finish Mating, they are designed to operate with a Gold Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 8μin (0.20μm), that offers Contact Finish Thickness Post features such as Flash, Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Contact Material Post, the device can also be used as Open Frame Features. In addition, the Housing Material is Polyphenylene Sulfide (PPS), Glass Filled, the device is offered in Through Hole Mounting Type, the device has a 24 (2 x 12) of Number of Positions or Pins Grid, it has an Operating Temperature range of -65°C ~ 125°C, and the Packaging is Bulk, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 100, and the Termination is Solder, and Type is DIP, 0.6" (15.24mm) Row Spacing.

Features