Samsung Semiconductor SIP-0P5WRS502

Overview

SIP050-1X32-157BLF with pin details, that includes SIP050-1x Series, they are designed to operate with a SIP Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, Mounting Type is designed to work in Through Hole, as well as the Closed Frame Features, the device can also be used as Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Housing Material. In addition, the Number of Positions or Pins Grid is 32 (1 x 32), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Tin of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 200μin (5.08μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Brass.

The SIP05-12S05A is "Non-Isolated DC/DC Converters POL Convert/5A/SIP 8.3-14Vin manufactured by Cincon. The SIP05-12S05A is available in SIP Package, is part of the DC DC Converters, , and with support for "Non-Isolated DC/DC Converters POL Convert/5A/SIP 8.3-14Vin, Non-Isolated DC/DC Converters POL Convert/5A/SIP 8.3-14Vin, .75-5Vout.

Features

Applications

• Low Noise Amplifier (LNA)
• Transmit
• Receive
• Switch
• Power management
• Internet of Things (IoT)
• Secure Payment
• Home and Security
• Health and Fitness
• Industrial and Data Logger