Infineon 4347805

Overview

The 34-3503-20 is CONN IC DIP SOCKET 34POS GOLD, that includes 503 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Wire Wrap, it has an Operating Temperature range of -55°C ~ 105°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyamide (PA46), Nylon 4/6, Glass Filled, the device is offered in 34 (2 x 17) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Phosphor Bronze.

The 34-3503-31 is CONN IC DIP SOCKET 34POS GOLD, that includes Wire Wrap Termination, they are designed to operate with a Through Hole Mounting Type, Housing Material is shown on datasheet note for use in a Polyamide (PA46), Nylon 4/6, Glass Filled, that offers Contact Material Post features such as Phosphor Bronze, Contact Finish Mating is designed to work in Gold, as well as the Gold Contact Finish Post, the device can also be used as DIP, 0.3" (7.62mm) Row Spacing Type. In addition, the Features is Closed Frame, the device is offered in Bulk Packaging, the device has a Beryllium Copper of Contact Material Mating, it has an Operating Temperature range of -55°C ~ 125°C, and the Series is 503, and Number of Positions or Pins Grid is 34 (2 x 17), and the Contact Finish Thickness Mating is 10μin (0.25μm), and Contact Finish Thickness Post is 10μin (0.25μm), and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).

Features