Infineon 75-0061PBF

Overview

116-83-610-41-002101 with pin details, that includes 116 Series, they are designed to operate with a DIP, 0.6" (15.24mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Elevated, Open Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, the device is offered in 10 (2 x 5) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 29.5μin (0.75μm), and Contact Material Mating is Beryllium Copper, and the Contact Material Post is Brass.

116-83-610-41-004101 with circuit diagram, that includes Gold Contact Finish Mating, they are designed to operate with a Tin Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 29.5μin (0.75μm), that offers Contact Material Mating features such as Beryllium Copper, Contact Material Post is designed to work in Brass, as well as the Elevated, Open Frame Features, the device can also be used as Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Housing Material. In addition, the Mounting Type is Through Hole, the device is offered in 10 (2 x 5) Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 125°C, and Packaging is Tube, and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm), and the Series is 116, and Termination is Solder, and the Type is DIP, 0.6" (15.24mm) Row Spacing.

Features