Infineon 9670VQ12FW640GOOGXUMA1

Overview

The 214-44-624-01-670800 is CONN IC DIP SOCKET 24POS TIN, that includes 214 Series, they are designed to operate with a DIP, 0.6" (15.24mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Surface Mount Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in 24 (2 x 12) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Tin, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Tin, and the Contact Finish Thickness Mating is 100μin (2.54μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 200μin (5.08μm), and Contact Material Post is Brass Alloy.

The 214-44-632-01-670800 is CONN IC DIP SOCKET 32POS TIN, that includes Tin Contact Finish Mating, they are designed to operate with a Tin Contact Finish Post, Contact Finish Thickness Mating is shown on datasheet note for use in a 100μin (2.54μm), that offers Contact Finish Thickness Post features such as 200μin (5.08μm), Contact Material Mating is designed to work in Beryllium Copper, as well as the Brass Alloy Contact Material Post, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in Surface Mount Mounting Type, the device has a 32 (2 x 16) of Number of Positions or Pins Grid, it has an Operating Temperature range of -55°C ~ 125°C, and the Packaging is Tube, and Pitch Mating is 0.100" (2.54mm), and the Pitch Post is 0.100" (2.54mm), and Series is 214, and the Termination is Solder, and Type is DIP, 0.6" (15.24mm) Row Spacing.

Features