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K10046561-502 XF

Infineon K10046561-502 XF

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Infineon Technologies
K10046561-502 XF
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Обновление цены:несколько месяцев назад

Гарантия качества Bostock

912ob9001 201514001 201545001 201813485 2016esdduns
Детали продукта

Overview

The 10046971-003LF is CONN PWR CARD EDGE 70POS DL VERT, that includes Black Color, they are designed to operate with a HPCE? Series, Product is shown on datasheet note for use in a Receptacles, that offers Packaging features such as Tray, Mounting Style is designed to work in Through Hole, as well as the 7 A Current Rating, the device can also be used as Solder Termination Style. In addition, the Voltage Rating is 1 kVAC, the device is offered in Press-Fit Termination, it has an Operating Temperature range of -5°C ~ 105°C, and Mounting Type is Through Hole, and the Contact Material is Copper Alloy, and Contact Finish is Gold, and the Contact Finish Thickness is 30μin (0.76μm), and Number of Positions is 69 Position, and the Pitch is 0.100" (2.54mm), and Number of Rows is 2, and the Gender is Female, and Contact Type is Cantilever, and the Card Thickness is 0.062" (1.57mm), and Card Type is Non Specified - Dual Edge, and the Number of Positions Bay Row is 35, and Housing Material is Thermoplastic, and the Temperature Range is - 5 C to + 105 C, and Contact Plating is Gold, and the Insulation Resistance is 5000 MOhms, and Mounting Angle is Vertical, and the Contact Arrangement is Power.

10046742-31223TLF with circuit diagram, that includes 0.062" (1.57mm) Card Thickness, they are designed to operate with a PCI Express? Card Type, Color is shown on datasheet note for use in a Blue, that offers Contact Finish features such as Gold, Contact Finish Thickness is designed to work in Flash, as well as the Copper Alloy Contact Material, the device can also be used as Cantilever Contact Type. In addition, the Features is Board Lock, Card Latch, Locking Ramp, the device is offered in Female Gender, the device has a Through Hole of Mounting Type, and Number of Positions is 164, and the Number of Positions Bay Row is , and Number of Rows is 2, and the Packaging is Tray, and Pitch is 0.039" (1.00mm), and the Series is HPCE?, and Termination is Solder, Staggered.

Features

Tray Package
Характеристики продукта
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Пакет: Лоток
Статус части: Устаревший
Infineon Technologies

Infineon Technologies

Infineon Technologies - ведущая мировая полупроводниковая компания, основанная в 1999 году со штаб-квартирой в Мюнхене, Германия. Компания специализируется на производстве высокопроизводительных силовых полупроводников, датчиков и микроконтроллеров для автомобильной промышленности, промышленности, управления питанием и IoT-сектора.

Новosti в реальном времени

Bostock по цифрам

Доход: 85M

$85 миллионов в доходах в 2022 году, увеличение на 63% по сравнению с 2021 годом.

Страны: 105

Bostock обслуживает клиентов в 105 странах мира.

Отгруженные части: 25M+

Мы отгрузили более 25 миллионов частей за последние пять лет, что составляет увеличение на 148% по сравнению с предыдущими пятью годами.

Производители: 950

В 2022 году Bostock продал части от более чем 950 производителей.

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