Infineon PRG832801-8B

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Overview

The 110-13-322-41-801000 is CONN IC DIP SOCKET 22POS GOLD, that includes 110 Series, they are designed to operate with a DIP, 0.3" (7.62mm) Row Spacing Type, Packaging is shown on datasheet note for use in a Tube, that offers Termination features such as Solder, it has an Operating Temperature range of -55°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Open Frame, Decoupling Capacitor Features. In addition, the Housing Material is Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, the device is offered in 22 (2 x 11) Number of Positions or Pins Grid, the device has a 0.100" (2.54mm) of Pitch Mating, and Contact Finish Mating is Gold, and the Pitch Post is 0.100" (2.54mm), and Contact Finish Post is Gold, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Contact Material Mating is Beryllium Copper, and the Contact Finish Thickness Post is 10μin (0.25μm), and Contact Material Post is Brass Alloy.

The 110-13-328-41-001000 is CONN IC DIP SOCKET 28POS GOLD, that includes Tube Packaging, they are designed to operate with a Through Hole Mounting Type, Termination is shown on datasheet note for use in a Solder, that offers Housing Material features such as Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Features is designed to work in Open Frame, as well as the Gold Contact Finish Mating, the device can also be used as Gold Contact Finish Post. In addition, the Type is DIP, 0.3" (7.62mm) Row Spacing, the device is offered in Brass Alloy Contact Material Post, the device has a Beryllium Copper of Contact Material Mating, it has an Operating Temperature range of -55°C ~ 125°C, and the Contact Finish Thickness Mating is 30μin (0.76μm), and Number of Positions or Pins Grid is 28 (2 x 14), and the Series is 110, and Contact Finish Thickness Post is 10μin (0.25μm), and the Pitch Mating is 0.100" (2.54mm), and Pitch Post is 0.100" (2.54mm).

Features