Infineon TD120N16SOFHPSA1

1,6 кВ119 A130°C (TJ)

Overview

Infineon Solder Bond Power Block IGBT Modules are bipolar power modules that are in a solder bond technology to address the specific requirements of cost-effective applications. These new PowerBlock modules expands its already comprehensive power module portfolio which, so far, was only using pressure contacts. With market prices of approximately 25 percent (depending on module/application) less than related pressure contact variants solder bond modules offer significant cost advantages in modules with smaller packages sizes of up to 50mm. The small solder PowerBlock modules are ideal for applications like standard drives or UPS, where the high robustness of pressure contacts is not necessarily a must.

Features

Tray Package
1 SCR, 1 Diode Number of SCRs, Diodes
1.6 kV Voltage - Off State
119 A Current - On State (It (AV)) (Max)
190 A Current - On State (It (RMS)) (Max)
2.5 V Voltage - Gate Trigger (Vgt) (Max)
100 mA Current - Gate Trigger (Igt) (Max)
250 mA Current - Hold (Ih) (Max)
130°C (TJ) Operating Temperature
Surface Mount Mounting Type
Module Package / Case