NXP ISI-QMC-PSB02

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Overview

76-PRS19033-12 with pin details, that includes PRS Series, they are designed to operate with a PGA, ZIF (ZIP) Type, Packaging is shown on datasheet note for use in a Bulk, that offers Termination features such as Solder, it has an Operating Temperature range of -65°C ~ 125°C, as well as the Through Hole Mounting Type, the device can also be used as Closed Frame Features. In addition, the Housing Material is Polyphenylene Sulfide (PPS), the device is offered in 0.100" (2.54mm) Pitch Mating, the device has a Gold of Contact Finish Mating, and Pitch Post is 0.100" (2.54mm), and the Contact Finish Post is Tin, and Contact Finish Thickness Mating is 30μin (0.76μm), and the Contact Material Mating is Beryllium Copper, and Contact Finish Thickness Post is 200μin (5.08μm), and the Contact Material Post is Beryllium Copper.

76PSB02 with circuit diagram, that includes Raised Actuator Level, they are designed to operate with a Piano Actuator Type, Circuit is shown on datasheet note for use in a SPST, that offers Contact Finish features such as Gold, Contact Material is designed to work in Copper Alloy, as well as the 150mA Current Rating, the device can also be used as 0.301" (7.65mm) Height Above Board. In addition, the Mounting Type is Through Hole, Right Angle, the device is offered in 2 Number of Positions, the device has a Tube of Packaging, and Pitch is 0.100" (2.54mm), Full, and the Series is 76, and Termination Style is PC Pin, and the Voltage Rating is 30VDC, and Washable is No.

Features