NXP MC100ES6254AC

Fanout Buffer (распределение), мультиплексор22:3

Overview

The MC100ES6226AC is IC CLK BUFFER 1:9 3GHZ 32LQFP, that includes 100ES Series, they are designed to operate with a Fanout Buffer (Distribution), Divider Type, Packaging is shown on datasheet note for use in a Tray, that offers Unit Weight features such as 0.002568 oz, Mounting Style is designed to work in SMD/SMT, as well as the 32-LQFP Package Case, the device can also be used as LVCMOS LVPECL Input Type, it has an Operating Temperature range of 0°C ~ 110°C, the device is offered in Surface Mount Mounting Type, the device has a LVPECL of Output Type, and Voltage Supply is 2.375 V ~ 3.465 V, and the Supplier Device Package is 32-LQFP (7x7), and Input is LVPECL, and the Output is LVCMOS, LVPECL, and Number of Circuits is 1, and the Ratio Input:Output is 1899/12/30 1:09:00, and Differential Input:Output is Yes/Yes, and the Frequency Max is 3GHz, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Current is 110 mA, and the Part # Aliases is MC100ES6226, and Max Output Freq is 3 GHz, and the Multiply Divide Factor is 1.

The MC100ES6226FA is IC CLK BUFFER 1:9 3GHZ 32LQFP, that includes Yes/Yes Differential Input:Output, they are designed to operate with a 3GHz Frequency Max, Input is shown on datasheet note for use in a LVPECL, that offers Mounting Type features such as Surface Mount, Number of Circuits is designed to work in 1, it has an Operating Temperature range of 0°C ~ 110°C, the device can also be used as LVCMOS, LVPECL Output. In addition, the Package Case is 32-LQFP, the device is offered in Tray Packaging, the device has a 1899/12/30 1:09:00 of Ratio Input:Output, and Series is 100ES, and the Supplier Device Package is 32-LQFP (7x7), and Type is Fanout Buffer (Distribution), Divider, and the Voltage Supply is 2.375 V ~ 3.465 V.

Features

Applications

• High performance communication system
• Data center
• Cloud computing
• Network
• High speed industry
• High-end consumer electronics
• Data communication
• Telecommunications
• Computing
• Medical imaging