NXP MC33MR2001V2VK

77 ГГц

Overview

MC33HB2001EKR2 with pin details, that includes Tape & Reel (TR) Alternate Packaging Packaging, they are designed to operate with a 32-SSOP (0.295", 7.50mm Width) Exposed Pad Package Case, Technology is shown on datasheet note for use in a Power MOSFET, it has an Operating Temperature range of -40°C ~ 150°C (TJ), Mounting Type is designed to work in Surface Mount, as well as the Slew Rate Controlled Features, the device can also be used as DC Motors, General Purpose Applications. In addition, the Interface is SPI, the device is offered in 5 V ~ 28 V Voltage Supply, the device has a 32-SOIC Exposed Pad of Supplier Device Package, and Fault Protection is Over Temperature, Over Voltage, UVLO, and the Output Configuration is Half Bridge (2), and Load Type is Inductive, and the Rds On Typ is 125 mOhm LS (Max), 125 mOhm HS (Max), and Voltage Load is 5 V ~ 28 V.

MC33HB2001FK with EDA / CAD Models, that includes Tray Alternate Packaging Packaging, they are designed to operate with a Surface Mount Mounting Type, Interface is shown on datasheet note for use in a SPI, that offers Features features such as Slew Rate Controlled, Technology is designed to work in Power MOSFET, as well as the Over Temperature, Over Voltage, UVLO Fault Protection, the device can also be used as Inductive Load Type. In addition, the Output Configuration is Half Bridge (2), the device is offered in DC Motors, General Purpose Applications, the device has a 5 V ~ 28 V of Voltage Supply, and Voltage Load is 5 V ~ 28 V, it has an Operating Temperature range of -40°C ~ 150°C (TJ), and Supplier Device Package is 32-PQFN (8x8), and the Package Case is 32-PowerQFN, and Rds On Typ is 125 mOhm LS (Max), 125 mOhm HS (Max).

Features