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MC9S08SU8VFK

NXP MC9S08SU8VFK

S0840 МГц8 КБ (8К x 8)

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NXP USA Inc.
MC9S08SU8VFK
IC MCU 8BIT 8KB FLASH 24QFN
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₽247.92

Обновление цены:несколько месяцев назад

Гарантия качества Bostock

912ob9001 201514001 201545001 201813485 2016esdduns
Детали продукта

Overview

The MC9S08SL8CTJ is IC MCU 8BIT 8KB FLASH 20TSSOP, that includes S08 Series, they are designed to operate with a MCU Product, Packaging is shown on datasheet note for use in a Tray, that offers Unit Weight features such as 0.002871 oz, Mounting Style is designed to work in SMD/SMT, as well as the 20-TSSOP (0.173", 4.40mm Width) Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Supplier Device Package is 20-TSSOP, the device is offered in 16 Number of I O, the device has a 40MHz of Speed, and EEPROM Size is 256 x 8, and the Core Processor is S08, and RAM Size is 512 x 8, and the Program Memory Type is FLASH, and Peripherals is LVD, POR, PWM, WDT, and the Connectivity is I2C, LIN, SCI, SPI, and Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V, and the Core Size is 8-Bit, and Program Memory Size is 8KB (8K x 8), and the Data Converters is A/D 12x10b, and Oscillator Type is External, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and the Operating Supply Voltage is 2.7 V to 5.5 V, and Interface Type is I2C SCI SLIC SPI, and the Core is HCS08, and Processor Series is MC9S08SL8, and the Data Bus Width is 8 bit, and Supply Voltage Max is 5.5 V, and the Supply Voltage Min is 2.7 V, and Maximum Clock Frequency is 40 MHz, and the Number of ADC Channels is 12, and Number of I Os is 16 I/O, and the Data RAM Size is 512 B, and Number of Timers Counters is 2 Timer, and the ADC Resolution is 10 bit.

The MC9S08SL16CTJ is IC MCU 8BIT 16KB FLASH 20TSSOP, that includes Tray Packaging, they are designed to operate with a SMD/SMT Mounting Style, Series is shown on datasheet note for use in a S08, that offers Core features such as S08, Processor Series is designed to work in MC9S08, as well as the LVD, POR, PWM, WDT Peripherals, the device can also be used as I2C, LIN, SCI, SPI Connectivity. In addition, the Interface Type is I2C SCI SLIC SPI, the device is offered in FLASH Program Memory Type, the device has a External of Oscillator Type, and Data Converters is A/D 12x10b, and the Core Size is 8-Bit, and Data Bus Width is 8 bit, and the RAM Size is 512 x 8, and Data RAM Size is 512 B, and the Operating Supply Voltage is 5.5 V, and Supply Voltage Max is 5.5 V, and the Speed is 40MHz, it has an Operating Temperature range of -40°C ~ 85°C (TA), and the EEPROM Size is 256 x 8, and Package Case is 20-TSSOP (0.173", 4.40mm Width), and the Supplier Device Package is 20-TSSOP, and Maximum Clock Frequency is 200 kHz, and the Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V, and Supply Voltage Min is 2.7 V, and the Number of Timers Counters is 2 Timer, and Program Memory Size is 16KB (16K x 8), and the Number of I Os is 16 I/O, and Number of I O is 16, and the Number of ADC Channels is 12, and ADC Resolution is 10 bit, and the Unit Weight is 0.002871 oz, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Core Processor is .

Features

S08 Series
Tray Package
S08 Core Processor
40MHz Speed
I²C, SCI Connectivity
PWM, WDT Peripherals
17 Number of I/O
8KB (8K x 8) Program Memory Size
FLASH Program Memory Type
768 x 8 RAM Size
4.5V ~ 18V Voltage - Supply (Vcc/Vdd)
A/D 8x12b Data Converters
Internal Oscillator Type
Surface Mount Mounting Type
Характеристики продукта
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Модельный ряд: S08
Пакет: Лоток
Статус части: Активный
Программируемые устройства: Не проверено
Основной процессор: S08
Размер ядра: 8-разрядный
Скорость: 40 МГц
Связь: I²C, SCI
Периферийные устройства: ШИМ, WDT
Количество входов/выходов: 17
Размер памяти программы: 8 КБ (8К x 8)
Тип программной памяти: FLASH
Объем оперативной памяти: 768 x 8
Напряжение питания (Vcc/Vdd): 4,5 В ~ 18 В
Преобразователи данных: A/D 8x12b
Тип генератора: Внутренний
Рабочая температура: -40°C ~ 105°C (TA)
Тип крепления: Поверхностный монтаж
Упаковка / Кейс: 24-UFQFN Открытая панель
Поставщик Упаковка устройства: 24-QFN (4x4)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc. является американским филиалом компании NXP Semiconductors, которая занимается проектированием, разработкой, производством и продажей полупроводниковой продукции. Компания специализируется на производстве полупроводниковых пластин в Остине (штат Техас) и Чандлере (штат Аризона) и выпускает высокопроизводительные решения для автомобильного, промышленного и коммуникационного рынков.

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Bostock по цифрам

Доход: 85M

$85 миллионов в доходах в 2022 году, увеличение на 63% по сравнению с 2021 годом.

Страны: 105

Bostock обслуживает клиентов в 105 странах мира.

Отгруженные части: 25M+

Мы отгрузили более 25 миллионов частей за последние пять лет, что составляет увеличение на 148% по сравнению с предыдущими пятью годами.

Производители: 950

В 2022 году Bostock продал части от более чем 950 производителей.

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