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MCIMX257CJM4

NXP MCIMX257CJM4

ARM926EJ-S400 МГцLPDDR, DDR, DDR210/100 Мбит/с (1)-40°C ~ 85°C (TA)

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NXP USA Inc.
MCIMX257CJM4
IC MPU I.MX25 400MHZ 400LFBGA
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Цена договорная

Обновление цены:несколько месяцев назад

Гарантия качества Bostock

912ob9001 201514001 201545001 201813485 2016esdduns
Детали продукта

Overview

The MCIMX255AJM4AR2 is IC MPU I.MX25 400MHZ 400MAPBGA, that includes i.MX25 Series, they are designed to operate with a Tape & Reel (TR) Alternate Packaging Packaging, Unit Weight is shown on datasheet note for use in a 0.029584 oz, that offers Mounting Style features such as SMD/SMT, Tradename is designed to work in i.MX, as well as the 400-LFBGA Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Supplier Device Package is 400-MAPBGA (17x17), the device is offered in SRAM Memory Type, the device has a 2.0V, 2.5V, 2.7V, 3.0V, 3.3V of Voltage I O, and Speed is 400MHz, and the Core Processor is ARM926EJ-S, and Number of Cores Bus Width is 1 Core, 32-Bit, and the RAM Controllers is LPDDR, DDR, DDR2, and Graphics Acceleration is No, and the Display & Interface Controllers is Keypad, LCD, Touchscreen, and Ethernet is 10/100 Mbps (1), and the USB is USB 2.0 + PHY (2), and Security Features is Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection, and the Number of Cores is 1 Core, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 1.45 V, and the Application is Multimedia Applications, and Interface Type is Ethernet I2C UART USB, and the Core is ARM926EJ-S, and Processor Series is i.MX255, and the Data Bus Width is 32 bit, and Maximum Clock Frequency is 400 MHz, and the L1 Cache Instruction Memory is 16 kB, and L1 Cache Data Memory is 16 kB, and the Data RAM Size is 128 kB, and I O Voltage is 1.75 V to 3.6 V, and the Number of Timers Counters is 4 x 32 bit, and Watchdog Timers is Watchdog Timer.

The MCIMX255AVM4 is IC MPU I.MX25 400MHZ 400MAPBGA, that includes ARM926EJ-S Core Processor, they are designed to operate with a Keypad, LCD, Touchscreen Display & Interface Controllers, Ethernet is shown on datasheet note for use in a 10/100 Mbps (1), that offers Graphics Acceleration features such as No, Number of Cores Bus Width is designed to work in 1 Core, 32-Bit, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as 400-LFBGA Package Case. In addition, the Packaging is Tray, the device is offered in LPDDR, DDR, DDR2 RAM Controllers, the device has a Boot Security, Cryptography, Secure Fusebox, Secure JTAG, Secure Memory, Tamper Detection of Security Features, and Series is i.MX25, and the Speed is 400MHz, and Supplier Device Package is 400-MAPBGA (17x17), and the USB is USB 2.0 + PHY (2), and Voltage I O is 2.0V, 2.5V, 2.7V, 3.0V, 3.3V.

Features

i.MX25 Series

Advanced power management—The heart of the device is a level of power management

throughout the IC that enables the multimedia features and peripherals to achieve minimum system

power consumption in active and various low-power modes. Power management techniques allow

the designer to deliver a feature-rich product that requires levels of power far lower than typical

industry expectations.

Multimedia powerhouse—The multimedia performance of the i.MX25 processor is boosted by a

16 KB L1 instruction and data cache system and further enhanced by an LCD controller (with

alpha blending), a CMOS image sensor interface, an A/D controller (integrated touchscreen

controller), and a programmable Smart DMA (SDMA) controller.

128 Kbytes on-chip SRAM—The additional 128 Kbyte on-chip SRAM makes the device ideal for

eliminating external RAM in applications with a small footprint RTOS. The on-chip SRAM allows

the designer to enable an ultra-low power LCD refresh.

Interface flexibility—The device interface supports connection to all common types of external

memories: MobileDDR, DDR, DDR2, NOR Flash, PSRAM, SDRAM and SRAM, NAND Flash,

and managed NAND.

Increased security—Because the need for advanced security for tethered and untethered devices

continues to increase, the i.MX25 processor delivers hardware-enabled security features that

enable secure e-commerce, Digital Rights Management (DRM), information encryption, robust

tamper detection, secure boot, and secure software downloads.

On-chip PHY—The device includes an HS USB OTG PHY and FS USB HOST PHY.

Fast Ethernet—For rapid external communication, a Fast Ethernet Controller (FEC) is included.

i.MX25 only supports Little Endian mode.



Surface Mount Mounting Type

Applications

Graphical remote controls

Human Machine Interface (HMI)

Residential and commercial control panels

Residential gateway (smart metering)

Handheld scanners and printers

Electronic point-of-sale terminals

Patient-monitoring devices




Характеристики продукта
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Модельный ряд: i.MX25
Пакет: Лоток
Статус части: Устаревший
Основной процессор: ARM926EJ-S
Количество ядер на ширину шины: 1 ядро, 32-разрядный
Скорость: 400 МГц
Контроллеры оперативной памяти: LPDDR, DDR, DDR2
Ускорение графики: Нет
Контроллеры дисплея и интерфейса: Клавиатура, ЖК-дисплей, сенсорный экран
Ethernet: 10/100 Мбит/с (1)
USB (универсальная последовательная шина): USB 2.0 + PHY (2)
Напряжение ввода/вывода: 2,0 В, 2,5 В, 2,7 В, 3,0 В, 3,3 В
Рабочая температура: -40°C ~ 85°C (TA)
Тип крепления: Поверхностный монтаж
Упаковка / Кейс: 400-LFBGA
Поставщик Упаковка устройства: 400-LFBGA (17x17)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc. является американским филиалом компании NXP Semiconductors, которая занимается проектированием, разработкой, производством и продажей полупроводниковой продукции. Компания специализируется на производстве полупроводниковых пластин в Остине (штат Техас) и Чандлере (штат Аризона) и выпускает высокопроизводительные решения для автомобильного, промышленного и коммуникационного рынков.

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Доход: 85M

$85 миллионов в доходах в 2022 году, увеличение на 63% по сравнению с 2021 годом.

Страны: 105

Bostock обслуживает клиентов в 105 странах мира.

Отгруженные части: 25M+

Мы отгрузили более 25 миллионов частей за последние пять лет, что составляет увеличение на 148% по сравнению с предыдущими пятью годами.

Производители: 950

В 2022 году Bostock продал части от более чем 950 производителей.

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