NXP MCIMX6G2AVM07AA

ARM® Cortex®-A7696 МГцLPDDR2, DDR3, DDR3L10/100 Мбит/с (2)-40°C ~ 125°C (TJ)

Overview

MCIMX6G2AVM05AA with pin details, that includes i.MX6UL Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 289-LFBGA, it has an Operating Temperature range of -40°C ~ 125°C (TJ), Supplier Device Package is designed to work in 289-MAPBGA (14x14), as well as the 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V Voltage I O, the device can also be used as 528MHz Speed. In addition, the Core Processor is ARMR CortexR-A7, the device is offered in 1 Core, 32-Bit Number of Cores Bus Width, the device has a Multimedia; NEON? SIMD of Co Processors DSP, and RAM Controllers is LPDDR2, DDR3, DDR3L, and the Graphics Acceleration is No, and Display & Interface Controllers is LCD, LVDS, and the Ethernet is 10/100 Mbps (2), and USB is USB 2.0 + PHY (2), and the Security Features is ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS.

MCIMX6G1CVM05AA with circuit diagram, that includes Multimedia; NEON? SIMD Co Processors DSP, they are designed to operate with a ARMR CortexR-A7 Core Processor, Display & Interface Controllers is shown on datasheet note for use in a LVDS, that offers Ethernet features such as 10/100 Mbps (1), Graphics Acceleration is designed to work in No, as well as the 1 Core, 32-Bit Number of Cores Bus Width, it has an Operating Temperature range of -40°C ~ 105°C (TJ). In addition, the Package Case is 289-LFBGA, the device is offered in Tray Packaging, the device has a LPDDR2, DDR3, DDR3L of RAM Controllers, and Security Features is ARM TZ, A-HAB, CAAM, CSU, SJC, SNVS, and the Series is i.MX6UL, and Speed is 528MHz, and the Supplier Device Package is 289-MAPBGA (14x14), and USB is USB 2.0 + PHY (2), and the Voltage I O is 1.2V, 1.35V, 1.5V, 1.8V, 2.5V, 2.8V, 3.3V.

Features

Single-core ARM Cortex-A7—The single-core A7 provides a cost-effective and power-efficient solution.

Multilevel memory system—The multilevel memory system of each device is based on the L1

instruction and data caches, L2 cache, and internal and external memory. The device supports

many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR

Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including

eMMC up to rev 4.4/4.41/4.5.

Smart speed technology—Power management implemented throughout the IC that enables

multimedia features and peripherals to consume minimum power in both active and various low

power modes.

Dynamic voltage and frequency scaling—The processor improves the power efficiency by scaling

the voltage and frequency to optimize performance.

Multimedia powerhouse—Multimedia performance is enhanced by a multilevel cache system,

NEON? MPE (Media Processor Engine) co-processor, a programmable smart DMA (SDMA)

controller, an asynchronous audio sample rate converter, and a Pixel processing pipeline (PXP) to

support 2D image processing, including color-space conversion, scaling, alpha-blending, and

rotation.

Applications

Telematics

Human Machine Interfaces (HMI)