NXP MCIMX6Y1CVM05AA

ARM® Cortex®-A7528 МГцLPDDR2, DDR3, DDR3L10/100 Мбит/с (1)-40°C ~ 105°C (TJ)

Overview

MCIMX6X4AVM08AB with pin details, that includes i.MX6SX Series, they are designed to operate with a Tray Packaging, Package Case is shown on datasheet note for use in a 400-LFBGA, it has an Operating Temperature range of -40°C ~ 125°C (TJ), Supplier Device Package is designed to work in 400-MAPBGA (14x14), as well as the 1.8V, 2.5V, 2.8V, 3.15V Voltage I O, the device can also be used as 200MHz, 800MHz Speed. In addition, the Core Processor is ARMR CortexR-A9, ARMR CortexR-M4, the device is offered in 2 Core, 32-Bit Number of Cores Bus Width, the device has a Multimedia; NEON? MPE of Co Processors DSP, and RAM Controllers is LPDDR2, LVDDR3, DDR3, and the Graphics Acceleration is Yes, and Display & Interface Controllers is Keypad, LCD, LVDS, and the Ethernet is 10/100/1000 Mbps (2), and USB is USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2), and the Security Features is A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE.

The MCIMX6X3EVO10AB is IC MPU I.MX6SOLOX 1GHZ 400BGA, that includes Yes Graphics Acceleration, they are designed to operate with a USB 2.0 + PHY (1), USB 2.0 OTG + PHY (2) USB, Packaging is shown on datasheet note for use in a Tray, that offers Co Processors DSP features such as Multimedia; NEON? MPE, RAM Controllers is designed to work in LPDDR2, LVDDR3, DDR3, as well as the Keypad, LCD Display & Interface Controllers, the device can also be used as i.MX6SX Series. In addition, the Core Processor is ARMR CortexR-A9, ARMR CortexR-M4, the device is offered in A-HAB, ARM TZ, CAAM, CSU, SNVS, System JTAG, TVDECODE Security Features, the device has a 400-MAPBGA (14x14) of Supplier Device Package, and Package Case is 400-LFBGA, and the Speed is 200MHz, 1GHz, it has an Operating Temperature range of -20°C ~ 105°C (TJ), and the Number of Cores Bus Width is 2 Core, 32-Bit, and Ethernet is 10/100/1000 Mbps (2), and the Voltage I O is 1.8V, 2.5V, 2.8V, 3.15V.

Features

Single-core Arm Cortex-A7—The single-core A7 provides a cost-effective and power-efficient

solution.

Multilevel memory system—The multilevel memory system of the processor is based on the L1

instruction and data caches, L2 cache, and internal and external memory. The processor supports

many types of external memory devices, including DDR3, low voltage DDR3, LPDDR2, NOR

Flash, NAND Flash (MLC and SLC), OneNAND?, Quad SPI, and managed NAND, including

eMMC up to rev 4.4/4.41/4.5.

Smart speed technology—Power management implemented throughout the IC that enables

multimedia features and peripherals to consume minimum power in both active and various low

power modes.

Dynamic voltage and frequency scaling—The power efficiency of devices by scaling the voltage

and frequency to optimize performance.

Multimedia powerhouse—The multimedia performance of the processor is enhanced by a multilevel

cache system, NEON? MPE (Media Processor Engine) co-processor, a programmable smart

DMA (SDMA) controller, an asynchronous audio sample rate converter, an Electrophoretic

Display (EPD) controller, and a Pixel processing pipeline (PXP) to support 2D image processing,

including color-space conversion, scaling, alpha-blending, and rotation.

2x Ethernet interfaces—2x 10/100 Mbps Ethernet controllers.

Applications

Telematics

Audio playback

Connected devices

IoT Gateway

Access control panels

Human Machine Interfaces (HMI)

Portable medical and health care

IP phones

Smart appliances

eReaders