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MK22FN128VDC10

NXP MK22FN128VDC10

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NXP USA Inc.
MK22FN128VDC10
KINETIS K22: 100MHZ CORTEX-M4F P
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Цена договорная

Обновление цены:несколько месяцев назад

Гарантия качества Bostock

912ob9001 201514001 201545001 201813485 2016esdduns
Детали продукта

Overview

The MK22DX256VMC5 is IC MCU 32BIT 256KB FLASH 121BGA, that includes Kinetis K20 Series, they are designed to operate with a Tray Packaging, Unit Weight is shown on datasheet note for use in a 0.006930 oz, that offers Mounting Style features such as SMD/SMT, Package Case is designed to work in 121-LFBGA, it has an Operating Temperature range of -40°C ~ 105°C (TA), the device can also be used as 121-MAPBGA (8x8) Supplier Device Package. In addition, the Number of I O is 56, the device is offered in 50MHz Speed, the device has a 4K x 8 of EEPROM Size, and Core Processor is ARMR CortexR-M4, and the RAM Size is 32K x 8, and Program Memory Type is FLASH, and the Peripherals is DMA, I2S, LVD, POR, PWM, WDT, and Connectivity is I2C, IrDA, SPI, UART/USART, USB, USB OTG, and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and Core Size is 32-Bit, and the Program Memory Size is 256KB (256K x 8), and Data Converters is A/D 20x16b, D/A 1x12b, and the Oscillator Type is Internal, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 1.71 V to 3.6 V, and the Interface Type is I2C I2S SPI UART USB, and Core is ARM Cortex M4, and the Processor Series is Kinetis, and Data Bus Width is 32 bit, and the Maximum Clock Frequency is 50 MHz, and Number of I Os is 16 I/O, and the Data RAM Size is 64 kB, and Number of Timers Counters is 4 Timer, and the ADC Resolution is 16 bit, and Data RAM Type is SRAM.

MK22FN128CAK10R with circuit diagram, that includes I2C, IrDA, SPI, UART/USART, USB, USB OTG Connectivity, they are designed to operate with a ARMR CortexR-M4 Core Processor, Core Size is shown on datasheet note for use in a 32-Bit, that offers Number of I O features such as , it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the Internal Oscillator Type, the device can also be used as 49-UFBGA, WLCSP Package Case. In addition, the Packaging is Tape & Reel (TR), the device is offered in DMA, I2S, LVD, POR, PWM, WDT Peripherals, the device has a 128KB (128K x 8) of Program Memory Size, and Program Memory Type is FLASH, and the RAM Size is 24K x 8, and Series is Kinetis K20, and the Speed is 100MHz, and Supplier Device Package is 49-WLCSP (2.92x3.14), and the Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V.

Features


  • Package: NXP-2017

  • Package/Case: 121-XFBGA

  • Device Package: 121-BGA (10x10)

  • RoHS: Lead free / RoHS Compliant





Applications


  • Industrial

  • Enterprise systems

  • Communications equipment


Характеристики продукта
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Пакет: Насыпной
Статус части: Активный
Программируемые устройства: Не проверено
NXP USA Inc.

NXP USA Inc.

NXP USA Inc. является американским филиалом компании NXP Semiconductors, которая занимается проектированием, разработкой, производством и продажей полупроводниковой продукции. Компания специализируется на производстве полупроводниковых пластин в Остине (штат Техас) и Чандлере (штат Аризона) и выпускает высокопроизводительные решения для автомобильного, промышленного и коммуникационного рынков.

Новosti в реальном времени

Bostock по цифрам

Доход: 85M

$85 миллионов в доходах в 2022 году, увеличение на 63% по сравнению с 2021 годом.

Страны: 105

Bostock обслуживает клиентов в 105 странах мира.

Отгруженные части: 25M+

Мы отгрузили более 25 миллионов частей за последние пять лет, что составляет увеличение на 148% по сравнению с предыдущими пятью годами.

Производители: 950

В 2022 году Bostock продал части от более чем 950 производителей.

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