NXP MKE14F512VLL16

ARM® Cortex®-M4F168 МГц512 КБ (512К x 8)

Overview

The MKE11R600DCGFC is MOSFET CoolMOS Power Mosfet 600V 15A, that includes MKE11R600DCG Series, they are designed to operate with a Tube Packaging, Unit Weight is shown on datasheet note for use in a 0.229281 oz, that offers Mounting Style features such as Through Hole, Tradename is designed to work in COOLMOS, as well as the ISOPLUS-i4-5 Package Case, the device can also be used as SiC Technology. In addition, the Number of Channels is 1 Channel, the device is offered in Single Configuration, the device has a 1 N-Channel of Transistor Type, and Fall Time is 4 ns, and the Rise Time is 6 ns, and Vgs Gate Source Voltage is 20 V, and the Id Continuous Drain Current is 15 A, and Vds Drain Source Breakdown Voltage is 600 V, and the Vgs th Gate Source Threshold Voltage is 3 V, and Rds On Drain Source Resistance is 165 mOhns, and the Transistor Polarity is N-Channel, and Typical Turn Off Delay Time is 75 ns, and the Typical Turn On Delay Time is 12 ns, and Qg Gate Charge is 40 nC.

MKE06Z64VQH4 with EDA / CAD Models, that includes Tray Packaging, they are designed to operate with a LVD, PWM, WDT Peripherals, Series is shown on datasheet note for use in a Kinetis KE06, that offers Oscillator Type features such as Internal, Program Memory Type is designed to work in FLASH, as well as the CAN, I2C, SPI, UART/USART Connectivity, the device can also be used as ARMR CortexR-M0+ Core Processor. In addition, the Data Converters is A/D 16x12b, D/A 2x6b, the device is offered in 8K x 8 RAM Size, the device has a 64-QFP of Package Case, and Supplier Device Package is 64-LQFP (10x10), and the Program Memory Size is 64KB (64K x 8), and Number of I O is 58, and the Speed is 48MHz, it has an Operating Temperature range of -40°C ~ 105°C (TA), and the Core Size is 32-Bit, and Voltage Supply Vcc Vdd is 2.7 V ~ 5.5 V.

Features

• Up to 168 MHz ARM Cortex-M4 core supporting a broad range of processing bandwidth requirements while maintaining excellent cost-effectiveness, easy-to-use packages and a wide range of memory densities.

• Enhanced robust IOs make sure high performance in noisy environments.

• FlexTimer featured 8-channel PWM supports three-phase motor control with dead time insertion and fault detection.

• 1-Msps 12-bit ADC with up to a 16-channel input per module with a fast sampling rate for prompt data conversion and storage.

• Analog comparator for fast response to external analogue change.

• Programmable delay block with flexible trigger system providing various interconnections for on-chip modules; ADC, DAC, FlexTimers, ACMP, and so on.

• CAN 2.0B-compliant FlexCAN provides a highly reliable serial communication interface for industry applications.

• FlexIO provides flexibility for serial communication interface implementation.

• Boot ROM provides on-chip boot code and serial port drivers that could save flash space and provide flexible boot options and in-system programming support.

• Packages with big pin pitches make manufacture easy with high yield.

• 8 KB Cache could improve the code and data access efficiency.

• Digital signal processing capabilities with floating point units offer outstanding computational power for control algorithms, sensor data processing, and audio processing, among others, while increasing math accuracy and reducing code size.

• MPU for memory protection and code safety.

• Faster time to market with comprehensive enablement solutions, including SDK (drivers, libraries, stacks), IDE, bootloader, RTOS, online community and more.

Applications

• General Uses