Infineon S29GL256P11FFIV10

32M x 8110 нс-40°C ~ 85°C (TA)

Overview

S29GL256P11FFIS50 with pin details, that includes GL-P Series, they are designed to operate with a Tray Packaging, Mounting Style is shown on datasheet note for use in a SMD/SMT, it has an Operating Temperature Range range of - 40 C to + 85 C, Package Case is designed to work in 64-LBGA, it has an Operating Temperature range of -40°C ~ 85°C (TA), the device can also be used as Parallel Interface. In addition, the Supplier Device Package is 64-Fortified BGA (13x11), the device is offered in 256M (32M x 8) Memory Size, the device has a FLASH - NOR of Memory Type, and Speed is 110ns, and the Architecture is Sector, and Format Memory is FLASH, and the Standard is Common Flash Interface (CFI), and Interface Type is Parallel, and the Organization is 32 M x 8, and Supply Current Max is 110 mA, and the Data Bus Width is 8 bit, and Supply Voltage Max is 3.6 V, and the Supply Voltage Min is 2.7 V, and Timing Type is Asynchronous.

S29GL256P11FFIS53 with circuit diagram, that includes FLASH Format Memory, they are designed to operate with a Parallel Interface, Memory Size is shown on datasheet note for use in a 256M (32M x 8), that offers Memory Type features such as FLASH - NOR, it has an Operating Temperature range of -40°C ~ 85°C (TA), as well as the 64-LBGA Package Case, the device can also be used as Tape & Reel (TR) Alternate Packaging Packaging. In addition, the Series is GL-P, the device is offered in 110ns Speed, the device has a 64-Fortified BGA (13x11) of Supplier Device Package.

Features

Applications

• supercomputers
• telecommunications
• workstations,
• DVD disk buffer
• data buffer
• nonvolatile BIOS memory
• Camcorders
• embedded logic
• eDRAM
• graphics card