NXP FS32V234CON1VUB

ARM® Cortex®-A531 ГГцDDR3, DDR3L, LPDDR2GbE (1)-40°C ~ 125°C (TJ)

Overview

The FS-327 is MODULE DIMM52016MB FLASH, that includes 60 mm x 44 mm Dimensions.

FS32R274KBK2MMM with EDA / CAD Models manufactured by NXP. The FS32R274KBK2MMM is available in BGA Package, is part of the IC Chips, * Microcontroller IC 257-MAPBGA (14x14), MCU 32-bit e200z7 RISC 2MB Flash 3.3V Tray.

Features

Quad Cortex-A53 cores running up to 1GHz, Plus M4 core up to 133 MHz

Dual APEX-2 vision accelerator cores enabled by APEX-CV, the Apex Core Framework, and APEX graph tool

Developed in compliance with ISO 26262 and can support safety application development for IEC 61508 and DO 178

3D GPU (GC3000)

Hardware security encryption on CSE3

Embedded image sensor processing (ISP) for HDR, color conversion, tone mapping, etc. enabled by ISP graph tool

MIPI CSI2 and parallel image sensor interfaces

4 MB on-chip system RAM with end-to-end ECC on all memories

DRAM controller support for DDR3 / DDR3L / LPDDR2

-40 to 125 °C (junction temperature) operation

621 FC-BGA 17 mm x 17 mm, 0.65 mm pitch

Applications

Air Conditioning (AC)

Anesthesia Unit Monitor

Continuous Positive Airway Pressure Machine (CPAP)

Electricity Generation

Front View Camera