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MC9S08QD2CSC

NXP MC9S08QD2CSC

S0816 МГц2 КБ (2К x 8)

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NXP USA Inc.
MC9S08QD2CSC
IC MCU 8BIT 2KB FLASH 8SOIC
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₽371.39

Обновление цены:несколько месяцев назад

Гарантия качества Bostock

912ob9001 201514001 201545001 201813485 2016esdduns
Детали продукта

Overview

The MC9S08QB8CWL is IC MCU 8BIT 8KB FLASH 28SOIC, that includes S08 Series, they are designed to operate with a MCU Product, Packaging is shown on datasheet note for use in a Tray, that offers Unit Weight features such as 0.026676 oz, Mounting Style is designed to work in SMD/SMT, as well as the 28-SOIC (0.295", 7.50mm Width) Package Case, it has an Operating Temperature range of -40°C ~ 85°C (TA). In addition, the Supplier Device Package is 28-SOIC W, the device is offered in 22 Number of I O, the device has a 20MHz of Speed, and Core Processor is S08, and the RAM Size is 512 x 8, and Program Memory Type is FLASH, and the Peripherals is LVD, PWM, WDT, and Connectivity is LIN, SCI, and the Voltage Supply Vcc Vdd is 1.8 V ~ 3.6 V, and Core Size is 8-Bit, and the Program Memory Size is 8KB (8K x 8), and Data Converters is A/D 8x12b, and the Oscillator Type is External, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Operating Supply Voltage is 1.8 V to 3.6 V, and the Interface Type is I2C SCI SPI, and Core is HCS08, and the Processor Series is MC9S08QB8, and Data Bus Width is 8 bit, and the Supply Voltage Max is 3.6 V, and Supply Voltage Min is 1.8 V, and the Maximum Clock Frequency is 20 MHz, and Number of ADC Channels is 8, and the Number of I Os is 22 I/O, and Data RAM Size is 512 B, and the Number of Timers Counters is 2 Timer, and ADC Resolution is 12 bit.

The MC9S08QB8CTGR is IC MCU 8BIT 8KB FLASH 16TSSOP, that includes LIN, SCI Connectivity, they are designed to operate with a S08 Core, Core Processor is shown on datasheet note for use in a S08, that offers Core Size features such as 8-Bit, Data Bus Width is designed to work in 8 bit, as well as the A/D 8x12b Data Converters, the device can also be used as 512 B Data RAM Size. In addition, the Data RAM Type is RAM, the device is offered in SCI Interface Type, the device has a 20 MHz of Maximum Clock Frequency, it has an Maximum Operating Temperature range of + 85 C, it has an Minimum Operating Temperature range of - 40 C, and Mounting Style is SMD/SMT, and the Number of I O is 12, and Number of I Os is 22 I/O, and the Number of Timers Counters is 2 Timer, and Operating Supply Voltage is 1.8 V to 3.6 V, it has an Operating Temperature range of -40°C ~ 85°C (TA), and Oscillator Type is External, and the Package Case is 16-TSSOP (0.173", 4.40mm Width), and Packaging is Tape & Reel (TR) Alternate Packaging, and the Peripherals is LVD, PWM, WDT, and Processor Series is MC9S08, and the Program Memory Size is 8KB (8K x 8), and Program Memory Type is FLASH, and the RAM Size is 512 x 8, and Series is S08, and the Speed is 20MHz, and Supplier Device Package is 16-TSSOP, and the Unit Weight is 0.002194 oz, and Voltage Supply Vcc Vdd is 1.8 V ~ 3.6 V.

Features

S08 Series
8-SOIC (0.154, 3.90mm Width) package
Mounting type of Surface Mount

Surface Mount Mounting Type

Applications


There are a lot of NXP USA Inc.
MC9S08QD2CSC Microcontroller applications.

  • Toys
  • Robots
  • Radio
  • Television
  • Heater/Fan
  • Calculator
  • Kindle
  • Christmas lights
  • 3D printers
  • Washing machine
Характеристики продукта
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Модельный ряд: S08
Пакет: Трубка
Статус части: Активный
Программируемые устройства: Не проверено
Основной процессор: S08
Размер ядра: 8-разрядный
Скорость: 16 МГц
Периферийные устройства: LVD, POR, PWM, WDT
Количество входов/выходов: 4
Размер памяти программы: 2 КБ (2К x 8)
Тип программной памяти: FLASH
Объем оперативной памяти: 128 x 8
Напряжение питания (Vcc/Vdd): 2,7 В ~ 5,5 В
Преобразователи данных: A/D 4x10b
Тип генератора: Внутренний
Рабочая температура: -40°C ~ 85°C (TA)
Тип крепления: Поверхностный монтаж
Упаковка / Кейс: 8-SOIC (ширина 0,154", 3,90 мм)
Поставщик Упаковка устройства: 8-SOIC
NXP USA Inc.

NXP USA Inc.

NXP USA Inc. является американским филиалом компании NXP Semiconductors, которая занимается проектированием, разработкой, производством и продажей полупроводниковой продукции. Компания специализируется на производстве полупроводниковых пластин в Остине (штат Техас) и Чандлере (штат Аризона) и выпускает высокопроизводительные решения для автомобильного, промышленного и коммуникационного рынков.

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Bostock по цифрам

Доход: 85M

$85 миллионов в доходах в 2022 году, увеличение на 63% по сравнению с 2021 годом.

Страны: 105

Bostock обслуживает клиентов в 105 странах мира.

Отгруженные части: 25M+

Мы отгрузили более 25 миллионов частей за последние пять лет, что составляет увеличение на 148% по сравнению с предыдущими пятью годами.

Производители: 950

В 2022 году Bostock продал части от более чем 950 производителей.

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