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MK22FN256VLL12

NXP MK22FN256VLL12

ARM® Cortex®-M4120 МГц256 КБ (256К x 8)

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NXP USA Inc.
MK22FN256VLL12
IC MCU 32BIT 256KB FLASH 100LQFP
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₽4761.65

Обновление цены:несколько месяцев назад

Гарантия качества Bostock

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Детали продукта

Overview

MK22FN256CAP12R with pin details, that includes Kinetis K20 Series, they are designed to operate with a Tape & Reel (TR) Packaging, Package Case is shown on datasheet note for use in a 80-UFBGA, WLCSP, it has an Operating Temperature range of -40°C ~ 85°C (TA), Supplier Device Package is designed to work in 80-WLCSP (4.13x3.56), as well as the 52 Number of I O, the device can also be used as 120MHz Speed. In addition, the Core Processor is ARMR CortexR-M4, the device is offered in 128K x 8 RAM Size, the device has a FLASH of Program Memory Type, and Peripherals is DMA, I2S, LVD, POR, PWM, WDT, and the Connectivity is I2C, IrDA, SPI, UART/USART, USB, USB OTG, and Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V, and the Core Size is 32-Bit, and Program Memory Size is 512KB (512K x 8), and the Data Converters is A/D 2x16b, D/A 2x12b, and Oscillator Type is Internal.

MK22FN256VLH12 with circuit diagram, that includes I2C, IrDA, SPI, UART/USART, USB, USB OTG Connectivity, they are designed to operate with a ARMR CortexR-M4 Core Processor, Core Size is shown on datasheet note for use in a 32-Bit, that offers Data Converters features such as A/D 22x16b, D/A 1x12b, Number of I O is designed to work in 40, it has an Operating Temperature range of -40°C ~ 105°C (TA), the device can also be used as Internal Oscillator Type. In addition, the Package Case is 64-LQFP, the device is offered in Tray Packaging, the device has a DMA, I2S, LVD, POR, PWM, WDT of Peripherals, and Program Memory Size is 256KB (256K x 8), and the Program Memory Type is FLASH, and RAM Size is 48K x 8, and the Series is Kinetis K20, and Speed is 120MHz, and the Supplier Device Package is 64-LQFP (10x10), and Voltage Supply Vcc Vdd is 1.71 V ~ 3.6 V.

Features

Kinetis K20 Series
  • Ultra-Low-Power

10 low-power modes with power and clock gating for optimal peripheral activity and recovery times. Stop currents of <500 nA, run currents of <200 μA/MHz, 4 μs wake-up from Stop mode

Full memory and analog operation down to 1.71 volts for extended battery life

Low-leakage wake-up unit with up to eight internal modules and 16 pins as wake-up sources in low-leakage stop (LLS)/very low-leakage stop (VLLS) modes

Low-power timer for continual system operation in reduced power state

Flash, SRAM, and FlexMemory

128 KB-1 MB flash. Fast access, high reliability with four-level security protection

  • 48-128 KB of SRAM

FlexMemory: 32 bytes-16 KB of user-segmentable byte write/erase EEPROM for data tables/system data. EEPROM with over 10M cycles and flash with 70 μsec write time (brownouts without data loss/corruption). No user or system intervention to complete programming and erase functions and full operation down to 1.71 volts. In addition, 128 KB of FlexNVM for extra program code, data or EEPROM backup

  • Mixed-Signal capability

Up to two high-speed, 16-bit analog-to-digital converters (ADCs) with configurable resolution. Single or differential output mode operation for improved noise rejection. 500 ns conversion time achievable with programmable delay block triggering

Up to two 12-bit digital-to-analog converters (DACs) for analog waveform generation for audio applications

Up to three high-speed comparators provide fast and accurate motor over-current protection by driving PWMs to a safe state

Analog voltage reference provides an accurate reference to analog blocks, ADC and DAC, and replaces external voltage references to reduce system cost

  • Performance

ARM Cortex-M4 core + DSP. 120 MHz, single-cycle MAC, single instruction multiple data (SIMD) extensions, single-precision floating point unit

Up to 16-channel DMA for peripheral and memory servicing with reduced CPU loading and faster system throughput

Cross bar switch enables concurrent multi-master bus accesses, increasing bus bandwidth

Independent flash banks allow concurrent code execution and firmware updating with no performance degradation or complex coding routines

  • Timing and Control

Up to four FlexTimers with a total of 20 channels. Hardware dead-time insertion and quadrature decoding for motor control

Carrier modulator timer for infrared waveform generation in remote control applications

Four-channel 32-bit periodic interrupt timer provides a time base for RTOS task scheduler or trigger source for ADC conversion and programmable delay block

  • Human-Machine Interface (HMI)

Up to 16 controllable GPIO with pin interrupt support

  • Connectivity and Communications

USB 2.0 On-The-Go (full-speed). Device charge detection optimizes charging current/time for portable USB devices enabling longer battery life. Low-voltage regulator supplies up to 120 mA off-chip at 3.3 volts to power external components from 5 volts input

Up to six UARTs with IrDA support including one UART with ISO7816 smart card support. Variety of data size, format and transmission/reception settings supported for multiple industrial communication protocols

Inter-IC Sound (I2S) serial interface for audio system interfacing

CAN module for industrial network bridging

  • Up to three DSPI and two I2C


Surface Mount Mounting Type

Applications

  • Home appliances

  • Home automation

  • Smart plugs and lights

  • Industrial wireless control

  • IP cameras

  • Sensor networks

  • Wearable electronics


Характеристики продукта
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Модельный ряд: Kinetis K20
Пакет: Лоток
Статус части: Активный
Программируемые устройства: Не проверено
Основной процессор: ARM® Cortex®-M4
Размер ядра: 32-разрядный одноядерный
Скорость: 120 МГц
Связь: I²C, IrDA, SPI, UART/USART, USB, USB OTG
Периферийные устройства: DMA, I²S, LVD, POR, PWM, WDT
Количество входов/выходов: 66
Размер памяти программы: 256 КБ (256К x 8)
Тип программной памяти: FLASH
Объем оперативной памяти: 48K x 8
Напряжение питания (Vcc/Vdd): 1,71 В ~ 3,6 В
Преобразователи данных: A/D 33x16b; D/A 1x12b
Тип генератора: Внутренний
Рабочая температура: -40°C ~ 105°C (TA)
Тип крепления: Поверхностный монтаж
Упаковка / Кейс: 100-LQFP
Поставщик Упаковка устройства: 100-LQFP (14x14)
NXP USA Inc.

NXP USA Inc.

NXP USA Inc. является американским филиалом компании NXP Semiconductors, которая занимается проектированием, разработкой, производством и продажей полупроводниковой продукции. Компания специализируется на производстве полупроводниковых пластин в Остине (штат Техас) и Чандлере (штат Аризона) и выпускает высокопроизводительные решения для автомобильного, промышленного и коммуникационного рынков.

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